CMM4000 Datasheet, PDF (7/9 Pages) List of Unclassifed Manufacturers – 2.0-18.0 GHz GaAs MMIC Low Noise Amplifier

2.0-18.0 GHz GaAs MMIC
Buffer Amplifier
September 2009 - Rev 21-Sep-09
App Note [1] Biasing - As shown in the bonding diagram, this device
operates using a self-biased architecture and only requires one drain bias.
Bias is nominally Vd=5V, I=115mA. Additionally there are three source
resistors on chip, 13, 12 and 8.5 Ohms. One of these must be bonded to
ground. Typically 12 Ohms is bonded to ground to achieve performance as
shown. Bonding to one of the other resistors or any or all in parallel may
allow additional performance adjustment.
App Note [2] Bias Arrangement - Each DC pad (Vd) needs to have DC
bypass capacitance (~100-200 pF) as close to the device as possible.
Additional DC bypass capacitance (~0.01 uF) is also recommended.
Current Select - At times the need to balance performance against system
power budgets forces a trade off between bias current, gain, P1dB, or other
parameters. This note includes information on how to use the built-in binary
bias ladder to adjust the currents enabling this trade off. The bias is controlled
by the self bias resistor network in the bottom right corner of the die. These
resistors have binary relative values so that you can step the current from a
minimum to a maximum with multiple different bias options available along
the way. The infinity option is not useful as there is no current flow with all
resistors open. Using the information from the current select table shown
here allows the user to set the resistors adjusting the current up or down
from a nominal value. In addition, the table can be used to estimate how to
make a change with minimum trial and error. The net result is that the current
can be adjusted over a wide range with incremental control.
Bonding Substrate - If you are concerned about dialing in the exact current
or making fine adjustments to the bias point it is recommended that a
bonding substrate, like the one shown here, be used. The purpose is to allow
the chip to substrate wire bonds to be left intact and not to be used for
adjustments. The bond wires that go from the substrate to ground are then
added or subtracted to tune the bias as necessary.
CMM4000-BD
CMM4000 - Source Resistance Table
Left
13
Center Corner
12
8.5
Net R ^{Delta Current}
mA
0
0
0
Infinity
NA
1
0
0
13.00
-140
0
1
0
12.00
-130
1
1
0
6.24
-80
0
0
1
8.50
-55
1
0
1
5.14
-30
0
1
1
4.98
-25
1
1
1
3.60
Max
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 7 of 9
Characteristic Data and Specifications are subject to change without notice. ©2009 Mimix Broadband, Inc.
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