CMM4000 Datasheet, PDF (6/9 Pages) List of Unclassifed Manufacturers – 2.0-18.0 GHz GaAs MMIC Low Noise Amplifier

2.0-18.0 GHz GaAs MMIC
Buffer Amplifier
September 2009 - Rev 21-Sep-09
Mechanical Drawing
1.000
(0.039)
1.414
(0.056)
2
CMM4000-BD
0.348
1
(0.014)
3
0.539
(0.021)
0.0
0.0
65 4
1.555 1.795
(0.061) (0.071)
1.675 ^1.890
(0.066) ^(0.074)
(Note: Engineering designator is M393)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.076 +/- 0.010 (0.003 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.080 x 0.080 (0.003 x 0.003). All RF Bond Pads are 0.180 x 0.080 (0.007 x 0.003).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.172 mg
Bond Pad #1 (RF In) Bond Pad #3 (RF Out) Bond Pad #5 (Rs-12 )
Bond Pad #2 (Vd)
Bond Pad #4 (Rs-8.5 ) Bond Pad #6 (Rs-13 )
Bias Arrangement
Vd
Bypass Capacitors - See App Note [2]
2
RF In 1
3 RF Out
654
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 6 of 9
Characteristic Data and Specifications are subject to change without notice. ©2009 Mimix Broadband, Inc.
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