PACKAGEDPINDIODES_15 Datasheet, PDF (6/7 Pages) M/A-COM Technology Solutions, Inc. – Packaged PIN Diodes

Packaged PIN Diodes
Recommended Groups B & C Testing
Per MIL-STD 750
Recommended methods and conditions for
Groups B, C and equivalent TX and TXV
level screening.
Inspection
Storage
Temperature
Operating
Temperature
Temperature
Cycling
Shock
Vibration
Constant
Acceleration
Humidity
Method
Condition
1031 See Maximum Ratings
——
1051
2016
See Maximum Ratings
5 cycles
- 65°C to +150°C
500g’s
2056
15g’s
2006
20,000g’s
1021
10 Days
V11
Recommended Screening
Per MIL-STD 750
Recommended methods and conditions
for equivalent TX and TXV level screening.
Inspection
Internal Visual
and / or X-Ray
High Temp.
Storage
Thermal Shock
Constant
Acceleration
Fine Leak
Method
Condition
2072, 2076
See Note
1032
48 hours min. @ max.
storage temp.
1051
10 Cycles
2006
20,000 g's, Y1
1071
H
Gross Leak
1071
C or E
Electrical
Burn-In
——
1038
See Note
See Note
Notes:
1. Conditions and details of test depend on specific model number. Information available upon request.
2. Case styles 1056 and 1088 are not military, MIL-STD-750, rated packages.
6
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Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.