MA4SW610B-1 Datasheet, PDF (6/6 Pages) Tyco Electronics – SP6T PIN Diode Switch with Integrated Bias Network

MA4SW610B-1
SP6T PIN Diode Switch with Integrated Bias Network
2 - 18GHz
Rev. V2
Assembly Considerations
The following precautions should be observed for successful assembly of the die.
Cleanliness
These chips should be handled in a clean environment free of dust and contaminants.
Electro-Static Sensitivity
The MA4SW Series PIN switches are ESD, Class 1 sensitive. The proper ESD handling procedures should be
used.
Wire Bonding
Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended.
A stage temperature of 150^oC and a force of 18 to 22 grams should be used. Ultrasonic energy should be
adjusted to the minimum required to achieve a good bond. RF bonds should be as short as possible to
minimize inductance.
Mounting
These chips have Ti-Pt-Au back metal. They can be die mounted with a 80Au/20Sn or Sn62/Pb36/Ag2 solder
preform or electrically conductive Ag epoxy. Mounting surface must be clean of oils and contaminants and flat.
Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255 ^oC and a tool
tip temperature of 265^oC. When hot gas is applied, the tool tip temperature should be 290 ^oC. The chip should
not be exposed to temperatures greater than 320^oC for more than 10 seconds. No more than 3 seconds should be
required for the attachment.
Epoxy Die Attachment
Assembly should be preheated to 125-150^oC. A Controlled thickness of 2 mils is recommended for best
electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after
placement. Cure epoxy per manufacturer’s recommended schedule.
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