MA4SW610B-1 Datasheet, PDF (1/6 Pages) Tyco Electronics – SP6T PIN Diode Switch with Integrated Bias Network

MA4SW610B-1
SP6T PIN Diode Switch with Integrated Bias Network
2 - 18GHz
Features
• Ultra Broad Bandwidth: 2GHz to 18GHz
• 1.9dB Insertion Loss, 35dB Isolation at 18GHz
• Reliable. Fully Monolithic, Glass Encapsulated
Construction
MA4SW610B-1 Layout
Rev. V2
Description
The MA4SW610B-1 is a reflective SP6T series
shunt broad band switch with integrated bias
networks made with M/A-COM’s HMIC^TM
(Heterolithic Microwave Integrated Circuit) process,
US Patent 5,268,310. This process allows the
incorporation of silicon pedestals that form series
and shunt diodes or vias by imbedding them in low
loss, low dispersion glass. By using small spacing
between elements, this combination of silicon and
glass gives HMIC devices low loss and high isolation
performance through 18 GHz.
Nominal Chip Dimensions
Applications
These high performance switches are suitable for
the use in multi-band ECM, Radar, and
instrumentation control circuits where high isolation
to insertion loss ratios are required. With a standard
+5V/-5V, TTL controlled PIN diode driver, 80ns
switching speeds are achieved.
Chip
RF
DC
Chip Dimensions (mm)
X
3370
Pad Dimensions (mm)
X
400
125
Pad Locations (mm)
Y
3120
Y
125
125
Absolute Maximum Ratings¹
@ T_AMB = +25°C (unless otherwise specified)
Parameter
Value
X
J1
0
J2
-1535
B2
-1535
J3
-1535
Y
0
+300
+1000
+1800
Operating Temperature
-65°C to +125°C
B3
-1535
J4
-750
+2500
+2820
Storage Temperature
-65°C to +150°C
B4
-50
J5
+750
+2820
+2820
RF CW Incident Power
+30dBm
B5
+1450
J6
+1535
+2820
+1800
DC Bias Current (Forward)
+/- 20mA
B6
+1535
J7
+1535
+1100
+300
Applied Voltage (Reverse)
15V
B7
+900
0
Pad Locations Relative to J1
Note:
1) Exceeding any of these values may result in
permanent damage.
Notes:
1) Topside and backside metallization is gold , 2.5μm
thick typical.
1
2) Yellow areas indicate bondpads
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
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Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.