MA4AGSW8-1_15 Datasheet, PDF (6/7 Pages) M/A-COM Technology Solutions, Inc. – SP8T AlGaAs PIN Diode Switch RoHS Compliant

MA4AGSW8-1
SP8T AlGaAs PIN Diode Switch
RoHS Compliant
Rev. V2
ASSEMBLY INSTRUCTIONS
CLEANLINESS
The chip should be handled in a clean environment.
STATIC SENSITIVITY
This device is considered ESD Class 1A, HBM. Proper ESD techniques should be used during handling.
GENERAL HANDLING
The protective polymer coating on the active areas of the die provides scratch and impact protection,
particularly for the metal air bridge, which contacts the diode’s anode. Die should primarily be handled with
vacuum pickup tools, or alternatively with plastic tweezers.
ASSEMBLY TECHNIQUES
The MA4AGSW8-1, AlGaAs switch is designed to be mounted with electrically conductive silver epoxy or with
a low temperature solder perform, which does not have a rich tin content.
SOLDER DIE ATTACH
Only solders which do not scavenge gold, such as 80Au/20Sn or Indalloy #2 is recommended. Do not expose
die to temperatures greater than 300°C for more than 10 seconds.
CONDUCTIVE EPOXY DIE ATTACH
Use a controlled thickness of approximately 2 mils for best electrical conductivity and lowest thermal
resistance. Cure epoxy per manufacturer’s schedule. Typically 150°C for 1 hour.
RIBBON/WIRE BONDING
Thermo-compression wedge or ball bonding may be used to attach ribbons or wire to the gold bonding pads.
A 1/4 x 3 mil gold ribbon is recommended on all RF ports and should be kept as short as possible for the
lowest inductance and best microwave performance. For more detailed handling and assembly
instructions, see Application Note M541, “Bonding and Handling Procedures for Chip Diode
Devices” at www.macom.com.
Ordering Information
Part Number
MA4AGSW8-1
Packaging
Waffle Pack
6
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