MA4SW510B-1_16 Datasheet, PDF (5/7 Pages) M/A-COM Technology Solutions, Inc. – Broad Bandwidth Specified up to 18 GHz

MA4SW510B-1
HMIC™ Silicon SP5T PIN Diode Switch
with Integrated Bias Network
Chip Dimensions^5,6
Rev. V4
5. Topside and backside metallization is gold, 2.5 µm thick typical.
6. Yellow areas indicate wire bonding pads.
DIM
A
B
C
D
E
F
G
RF Bond Pads (J1 - J6)
DC Bond Pads (B2 - B6)
Chip Thickness
Mils
Min.
Max.
54.0
55.0
27.0
28.0
30.0
31.0
31.0
32.0
19.0
20.0
118.5
120.5
35.0
36.0
7.0 x 5.0 ref.
5.0 x 5.0 ref.
5.0 ref.
Millimeters
Min.
Max.
1.37
1.40
0.69
0.71
0.76
0.79
0.79
0.81
0.48
0.51
3.01
3.06
0.89
0.91
0.178 x 0.127 ref.
0.127 x 0.127 ref.
0.127 ref.
5
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