MA4SW410_14 Datasheet, PDF (5/6 Pages) M/A-COM Technology Solutions, Inc. – HMIC Silicon SP4T PIN Diode Switch

MA4SW410
HMIC™ Silicon SP4T PIN Diode Switch
MA4SW410 Chip Dimensions^5,6
A
C
D
Rev. V6
EB
J
5. Topside and backside metallization is gold, 2.5 µm thick typical.
6. Yellow areas indicate wire bonding pads.
GF
H
I
All tolerances are ± .0005 inches
DIM
A
B
C
D
E
F
G
H
I
J
Thickness
Bond Pads
Nominal
inches
0.066
0.047
0.054
0.012
0.043
0.009
0.004
0.004
0.033
0.061
0.005
0.005 x 0.005
mm
1.67
1.19
1.37
0.31
1.08
0.22
0.11
0.11
0.84
1.56
.120
0.120 x 0.120
5
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