MA4SW410B-1_14 Datasheet, PDF (5/6 Pages) M/A-COM Technology Solutions, Inc. – Broad Bandwidth Specified up to 18 GHz

MA4SW410B-1
HMIC™ Silicon SP4T PIN Diode Switch
with Integrated Bias Network
Chip Dimensions^5,6
I
H
F
E
D
I
G
F
A
E
D
Rev. V4
C
C
B
5. Topside and backside metallization is gold, 2.5 µm thick typical.
6. Yellow areas indicate wire bonding pads.
Mils
Millimeters
DIM
Min.
Max.
Min.
Max.
A
86.0
90.0
2.18
2.29
B
106.0
110.0
2.69
2.79
C
49.5
50.5
1.26
1.28
D
8.0
9.0
0.20
0.23
E
25.0
26.0
0.64
0.66
F
25.0
26.0
0.64
0.66
G
19.0
20.0
0.48
0.51
H
47.5
48.5
1.21
1.23
I
25.5
26.5
0.65
0.67
RF Bond Pads (J1 - J5)
7.0 x 5.0 ref.
0.178 x 0.127 ref.
DC Bond Pads (B2 - B5)
5.0 x 5.0 ref.
0.127 x 0.127 ref.
Chip Thickness
5.0 ref.
0.127 ref.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support