XR1004-BD_15 Datasheet, PDF (4/8 Pages) M/A-COM Technology Solutions, Inc. – Receiver

XR1004-BD
Receiver
30.0-46.0 GHz
Mechanical Drawing
1.620
(0.064)
1.170
(0.046)
2
1.571
(0.062)
1.871
(0.074)
3
4
2.470
(0.097)
5
Rev. V1
6
0.646
(0.025)
0.298
1
(0.012)
12
11
10
9
8
7
0.0
0.0
1.170
1.571
1.871
2.271
2.671
3.071
3.970
(0.046)
(0.062) (0.074)
(0.089)
(0.105)
(0.121)
(0.156)
(Note: Engineering designator is 40REC0452)
Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold
All DC/IFBond Pads are 0.100 x 0.100 (0.004 x 0.004).All RFBond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:3.987 mg.
Bond Pad #1 (RFIn) Bond Pad #3 (Vd2) Bond Pad #5 (Vd3) Bond Pad #7 (Vg5) Bond Pad #9 (Vg4) Bond Pad #11 (Vg2)
Bond Pad #2 (Vd1) Bond Pad #4 (IF1) Bond Pad #6 (LO) Bond Pad #8 (Vg3) Bond Pad #10 (IF2) Bond Pad #12 (Vg1)
Bias Arrangement
Vd2
Vd 1
IF1
2
3
4
5
Vd3
Bypass Capacitors - See App Note [2]
Vd1,2
Vd3
IF1
RF ¹
Vg 1
12
11
10
IF2
Vg2
9
8
7
Vg4
Vg3
RF
6 RF Out
XR1004-BD
Vg5
LO
Vg5
IF2
Vg1,2
Vg4 Vg3
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.