S2083 Datasheet, PDF (4/14 Pages) M/A-COM Technology Solutions, Inc. – Surface Mount Instructions for QFN / DFN Packages

Application Note
S2083
Surface Mount Instructions for QFN / DFN Packages
Rev. V10
Package
Type
X1-DFN
PDFN
PDFN
PDFN
STQFN
STQFN
PQFN
PQFN
PQFN
PQFN
PQFN
PQFN
PQFN
PQFN
PQFN
PQFN
PQFN
Table 1. Recommended PCB Land Pattern Dimensions
Package Description
Size
(mm)
No. of
Leads
1x1
6
PCB Land Pattern Dimensions (mm)
Lead Pitch
(mm)
Tp
X
L
0.35
Fig. 1-2
0.18
0.20
1.2 x 1.5
6
0.50
Fig. 1-2
0.25
0.40
1.5 x 1.2
6
0.40
Fig. 1-3
0.23
0.315
2x2
8
0.50
Fig. 1-2
0.28
0.40
2x2
12
0.40
0.82
0.23
0.34
2 x 2.5
14
0.40
Fig.1-3
0.23
0.34
3x3
12
0.50
1.2
0.28
0.65
3 x 3 (1.45 mm Exp. Pad)
16
0.50
1.5
0.28
0.50
3 x 3 (1.7 mm Exp. Pad)
16
0.50
1.6
0.28
0.45
4x4
16
0.65
2.2
0.37
0.65
4x4
20
0.50
2.2
0.28
0.65
4x4
24
0.50
2.55
0.28
0.50
4 x 6 (V1)
32
0.50
Fig. 1-3
0.28
0.50
5 x 5 (std)
20
0.65
3.2
0.37
0.65
5 x 5 (Power Amp.)
20
0.65
3.2
0.37
0.65
5x5
28
0.50
3.2
0.28
0.65
6x6
28
0.65
4.5
0.40
0.50
Max #
of Vias
1
1
2
3
4
6
2
2
2
5
5
5
5
9
Fig.1-3
9
18
4
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.