S2083 Datasheet, PDF (12/14 Pages) M/A-COM Technology Solutions, Inc. – Surface Mount Instructions for QFN / DFN Packages

Application Note
S2083
Surface Mount Instructions for QFN / DFN Packages
Rev. V10
Reflow Profile
The most common solder reflow method is
accomplished in a belt furnace using convection
heat transfer. Tables 3 thru 5 along with Figure 4
show a typical convection reflow profile of
temperature versus time. The profile reflects the
three distinct heating stages, or zones (preheat,
reflow, and cooling) recommended in automated
reflow processes to ensure reliable, finished solder
joints. The profile will vary among soldering
systems and is intended as an example to use as a
starting point. Other factors that can affect the
profile include the density and types of components
on the board, type of solder used and type of board
or substrate material being used.
Thermocouples should be securely attached to the
top surface of a representative component to
insure the temperature exposure is met. Profile
should be recorded by data acquisition for future
reference.
General Soldering Precautions
The melting temperature of solder generally
exceeds the recommended maximum operating
temperature of the device. When the entire device
is heated to a high temperature, failure to complete
soldering within a short time could result in device
failure. Therefore, always observe the following
instructions to minimize the thermal stress to the
devices.
 Always preheat the device (failure to do so can
cause excessive thermal shock and stress that
can result in damage to the device).
 Limit the temperature in the reflow stage to peak
temperature indicated in Tables 3 thru 5.
 After completing the soldering process, allow the
devices to cool naturally for at least 3 minutes.
Gradual cooling should be used, as the use of
forced cooling will increase the temperature
gradient and may result in latent failure due to
mechanical stress.
 Avoid any mechanical stress or shock to the
solder joints and devices during cooling.
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