MA4E2037_V3 Datasheet, PDF (4/4 Pages) M/A-COM Technology Solutions, Inc. – GaAs Beam Lead Schottky Diodes

MA4E2037, MA4E2038, MA4E2039, MA4E2040
GaAs Beam Lead Schottky Diodes
Rev. V3
Handling Procedures
The following precautions should be observed to avoid damaging these chips:
Cleanliness:
The chips should be handled in a clean environment.
Do not attempt to clean die after installation.
Static Sensitivity: Schottky barrier diodes are ESD sensitive and can be damaged by static
electricity. Proper ESD techniques should be used when handling these
devices.
General Handling: The protective polymer coating on the active areas of these die provides
scratch protection, particularly for the metal air bridge which contacts the
anode. Beam lead devices must, however, must be handled with care since
the leads may be easily distorted or broken by the normal pressures
exerted when handled by tweezers. A vacuum pencil with a # 27 tip is
recommended for picking and placing.
Mounting Techniques
These devices are designed to be inserted onto hard or soft substrates. Recommended methods of attachment
include thermo-compression bonding, parallel- gap welding, solder reflow and conductive epoxy.
See application note M541, “ Bonding and Handling Procedures for Chip Diode Devices “ for detailed instruc-
tions.
4
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.