MA4GP905 Datasheet, PDF (3/3 Pages) M/A-COM Technology Solutions, Inc. – GaAs Beamlead PIN Diode

MA4GP905
GaAs
Beamlead PIN Diode
RoHS Compliant
Rev. V2
Handling and Assembly Procedures
The following precautions should be observed to avoid damaging these devices.
Cleanliness
These devices should be handled in a clean environment.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are Class 1 ESD sensitive and can be damaged by static
electricity. Proper ESD techniques should be used when handling these devices.
General Handling
These devices have a polymer layer which provides scratch protection for the junction area and the
anode air bridge. Beam lead devices must, however, be handled with extreme care since the leads
may easily be distorted or broken by the normal pressures exerted when handled with tweezers. A
vacuum pencil with a #27 tip is recommended for picking and placing.
Attachment
These devices were designed to be inserted onto hard or soft substrates. Recommended methods
of attachment include thermo-compression bonding, parallel-gap welding and electrically conductive
silver epoxy.
See Application Note M541 page 8, Bonding and Handling and Procedures for Chip Diode Devices
for more detailed assembly instructions.
Ordering Information
Part Number
MA4GP905
Packaging
Gel Pak
3
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Solutions has under development. Performance is based on engineering tests. Specifications are
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typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.