MA4E2502 Datasheet, PDF (2/5 Pages) Tyco Electronics – SURMOUNTTM Low, Medium and High Barrier Silicon Schottky Diodes

MA4E2502 Series
SURMOUNT^TM Low, Medium, and High
Barrier Silicon Schottky Diodes
Electrical Specifications @ 25°C
Model
Number
Type
Recommended Vf @ 1 mA Vb @ 10 uA Ct @ 0 V
Freq. Range
(mV)
(V)
(pF)
MA4E2502L
MA4E2502M
Low Barrier
Medium
Barrier
DC - 18 GHz
DC - 18 GHz
330 Max
300 Typ
470 Max
420 Typ
3 Min
5 Typ
3 Min
5 Typ
0.12 Max
0.10 Typ
0.12 Max
0.10 Typ
MA4E2502H
High Barrier
DC - 18 GHz
700 Max
650 Typ
3 Min
5 Typ
0.12 Max
0.10 Typ
1. Rt is the dynamic slope resistance where Rt = Rs + Rj, where Rj = 26 / Idc (Idc is in mA)
M/A-COM Products
Rev. V7
Rt Slope Resistance
(Vf1-Vf2)/(10.5mA-9.5mA)
(Ω)
16 Typ
20 Max
12 Typ
18 Max
11 Typ
15 Max
Handling
All semiconductor chips should be handled with
care to avoid damage or contamination from per-
spiration and skin oils. The use of plastic tipped
tweezers or vacuum pickups is strongly recom-
mended for individual components. The top sur-
face of the die has a protective polyimide coating to
minimize damage.
The rugged construction of these Surmount de-
vices allows the use of standard handling and die
attach techniques. It is important to note that in-
dustry standard electrostatic discharge (ESD) con-
trol is required at all times, due to the sensitive na-
ture of Schottky junctions.
Bulk handling should insure that abrasion and me-
chanical shock are minimized.
Absolute Maximum Ratings @ 25°C
(unless otherwise noted) ¹
Parameter
Absolute Maximum
Operating Temperature
-40°C to +125°C
Storage Temperature
-40°C to +150°C
Junction Temperature
+175°C
Forward Current
20 mA
Reverse Voltage
5V
Die Bonding
Die attach for these devices is made simple
through the use of surface mount die attach tech-
nology. Mounting pads are conveniently located on
the bottom surface of these devices, and are oppo-
site the active junction. The devices are well suited
for high temperature solder attachment onto hard
substrates. 80Au/20Sn and Sn63/Pb37 solders are
acceptable for usage. Die attach with Electrically
Conductive Silver Epoxy is Not Recommended.
For Hard substrates, we recommend utilizing a
vacuum tip and force of 60 to 100 grams applied
uniformly to the top surface of the device, using a
hot gas bonder with equal heat applied across the
bottom mounting pads of the device. When solder-
ing to soft substrates, it is recommended to use a
lead-tin interface at the circuit board mounting
pads. Position the die so that its mounting pads
are aligned with the circuit board mounting pads.
Reflow the solder paste by applying equal heat to
the circuit at both die-mounting pads. The solder
joint must Not be made one at a time, creating un-
equal heat flow and thermal stress. Solder reflow
should Not be performed by causing heat to flow
through the top surface of the die. Since the HMIC
glass is transparent, the edges of the mounting
pads can be visually inspected through the die after
die attach is completed.
RF C.W. Incident Power
+20 dBm
RF & DC Dissipated Power
50 mW
Electrostatic Discharge
( ESD ) Classification ²
Class 0
2 ^{2. Human Body Model}
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-
ment to produce in volume is not guaranteed.
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