M02013_15 Datasheet, PDF (2/21 Pages) M/A-COM Technology Solutions, Inc. – CMOS Transimpedance Amplifier with AGC for Fiber-optic Networks up to 3.2 Gbps

M02013
CMOS Transimpedance Amplifier with AGC
for Fiber-optic Networks up to 3.2 Gbps
Rev V8
Ordering Information
Part Number
Package
M02013-xx*
Waffle Pack
M02013-xx*
Expanded whole wafer on a ring
NOTE:
*xx represents the revision number. Please contact your local sales office for correct digits.
Operating Temperature
–40 °C to 85 °C
–40 °C to 85 °C
Revision History
Revision
Level
V8
G (V7)
Release
Release
F (V6)
Release
E (V5)
Release
Date
Description
May 2015
Updated logos and page layout. No content changes.
October 2007 Updated “Typical Applications Diagram” on the front page to show Imon connection. Corrected Imon
configuration in Figure 4-1. Corrected PinK connection in the “Alternative Circuit” in Figure 4-1.
September 2007
Corrected PinA absolute maximum voltage in Table 1-1. Added specifications for Imon in Section 1.4.
Added Imon typical performance graph in Figure 1-4. Updated Imon pin description in Section 2.1.
Updated Imon functional description in Section 3.2.4. Added applications information for Imon
calibration in Section 4.4.
June 2007
Revised Table 1-1. Separate Applications Information from Functional Description. Add notes to clarify
the bonding procedure. Correct bond pad coordinates (x and y values transposed).
Typical Eye Diagram
Pad Configuration
2
V_CC
3 _PINK
1
12
11
AGC DOUT DOUTGND
10
GND
Eye Diagram for 3.2 Gbps at -20 dBm Input Signal
4 PINA
V_CC
5
GND
MON DOUT DOUTGND
9
6
7
8
Die size ≈ 1090 x 880 µm
2
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