XB1005-BD_15 Datasheet, PDF (10/14 Pages) M/A-COM Technology Solutions, Inc. – Buffer Amplifier

XB1005-BD
Buffer Amplifier
35.0-45.0 GHz
Mechanical Drawing
1.300
(0.051)
1.113 1.514 1.715
(0.044) (0.060) (0.067)
2
34
Rev. V1
0.699
1
(0.028)
5
0.577
(0.023)
0.0
0.0
8
76
0.655 1.054 1.255
(0.026) (0.042) (0.049)
2.400
(0.095)
(Note: Engineering designator is 40LN3UA0063)
Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold
All DCBond Pads are 0.100 x 0.100 (0.004 x 0.004).All RFBond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:1.931 mg.
Bond Pad #1 (RFIn)
Bond Pad #3 (Vd2)
Bond Pad #5 (RFOut)
Bond Pad #7 (Vg2)
Bond Pad #2 (Vd1)
Bond Pad #4 (Vd3)
Bond Pad #6 (Vg3)
Bond Pad #8 (Vg1)
Bias Arrangement
2
34
Vd1,2,3
Bypass Capacitors - See App Note [2]
Vd1,2,3
RF In 1
8
76
5 RF Out
Vg1,2,3
RF In
RF Out
Vg1,2,3
10
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.