XB1005-BD_15 Datasheet, PDF (1/14 Pages) M/A-COM Technology Solutions, Inc. – Buffer Amplifier

XB1005-BD
Buffer Amplifier
35.0-45.0 GHz
Features
 High Dynamic Range
 Excellent LO Driver/Buffer Amplifier
 Low Noise or Power Bias Configurations
 23.0 dB Small Signal Gain
 2.7 dB Noise Figure at Low Noise Bias
 +16 dBm P1dB Compression at Power Bias
 100% On-Wafer RF, DC and Noise Figure
Testing
 100% Commercial-Level Visual Inspection Using
Mil-Std-883 Method 2010
 RoHS* Compliant and 260°C Reflow Compatible
Description
M/A-COM Tech’s three stage 35.0-45.0 GHz GaAs
MMIC buffer amplifier has a small signal gain of 23.0
dB with a noise figure of 2.7 dB across the band.
This MMIC uses M/A-COM Tech’s GaAs PHEMT
device model technology, and is based upon
electron beam lithography to ensure high
repeatability and uniformity. The chip has surface
passivation to protect and provide a rugged part with
backside via holes and gold metallization to allow
either a conductive epoxy or eutectic solder die
attach process. This device is well suited for
Millimeter-wave Point-to-Point Radio, SATCOM and
VSAT applications.
Ordering Information
Part Number
Package
XB1005-BD-000V
“V” - vacuum release
gel paks
XB1005-BD-EV1
evaluation module
Chip Device Layout
Rev. V1
Absolute Maximum Ratings
Parameter
Absolute Max.
Supply Voltage (Vd)
Supply Current (Id)
Gate Bias Voltage (Vg)
Input Power (Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
Channel Temperature (Tch)
+6.0 VDC
180 mA
+0.3 V
+5 dBm
-65 °C to +165 °C
-55 °C to MTTF
Table¹
MTTF Table¹
1. Channel temperature directly affects a device's MTTF. Chan-
nel temperature should be kept as low as possible to maximize
lifetime.
1
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.