DS56 Datasheet, PDF (9/33 Pages) Dallas Semiconductor – Dual Temperature Comparator

Reflow Soldering Characteristics
JEDEC 020c
Profile Feature
Average Ramp Up Rate (Ts_max to T_p)
Preheat Temperature Min (Ts_min)
Preheat Temperature Max (Ts_max)
Preheat Time (ts_min to ts_max)
Time Maintained Above Temperature (T_L)
Time Maintained Above Time (t_L)
Peak / Classification Temperature (T_P)
Time Within 5°C of Actual Peak Temperature (t_P)
Ramp Down Rate
Time 25°C to Peak Temperature
Table 7.
Lead Free Assembly
3°C / second max
150°C
200°C
60 180 seconds
217°C
60 150 seconds
260°C
20 40 seconds
6°C / second max
8 minutes max
Notes for Table 7:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the
package body.
LUXEON Rebel Datasheet DS56 (7/07)
9