DS56 Datasheet, PDF (11/33 Pages) Dallas Semiconductor – Dual Temperature Comparator

Pad Configuration
Figure 2. Pad Configuration.
Note for Figure 2:
1. The Thermal Pad is electrically isolated from the Anode and Cathode contact pads.
Solder Pad Design
Note for Figure 3:
The photograph below shows the recommended LUXEON Rebel layout on Printed Circuit Board (PCB). This design easily
achieves a thermal resistance of 7K/W.
Application Brief AB32 provides extensive details for this layout. In addition, the .dwg files are available upon request.
Figure 3. Solder Pad Layout.
LUXEON Rebel Datasheet DS56 (7/07)
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