LTC3616 Datasheet, PDF (4/28 Pages) Linear Technology – 6A, 4MHz Monolithic Synchronous Step-Down DC/DC Converter

LTC3616
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating junction
temperature range, otherwise specifications are at T_J = 25°C. V_IN = 3.3V, RT/SYNC = SV_IN unless otherwise specified (Notes 1, 2, 11).
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX UNITS
PGOOD
Power Good Voltage Windows
TRACK/SS = SV_IN, Entering Window
V_FB Ramping Up
–3
–6
%
V_FB Ramping
3
6
%
Down
TRACK/SS = SV_IN, Leaving Window
V_FB Ramping Up
V_FB Ramping
Down
9
11
%
–9
–11
%
t_PGOOD
R_PGOOD
Power Good Blanking Time
Entering and Leaving Window
Power Good Pull-Down On-Resistance
70
105
140
μs
8
17
33
Ω
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3616E is guaranteed to meet performance specifications
over the 0°C to 85°C operating junction temperature range. Specifications
over the –40°C to 125°C operating junction temperature range are
assured by design, characterization and correlation with statistical process
controls. The LTC3616I is guaranteed to meet specifications over the
full –40°C to 125°C operating junction temperature range. Note that
the maximum ambient temperature is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
resistance and other environmental factors.
Note 3: This parameter is tested in a feedback loop which servos V_FB to
the midpoint for the error amplifier (V_ITH = 0.75V).
Note 4: External compensation on ITH pin.
Note 5: Tying the ITH pin to SV_IN enables the internal compensation and
AVP mode.
Note 6: Dynamic supply current is higher due to the internal gate charge
being delivered at the switching frequency.
Note 7: See description of the TRACK/SS pin in the Pin Functions section.
Note 8: In sourcing mode the average output current is flowing out of SW
pin. In sinking mode the average output current is flowing into the SW Pin.
Note 9: See description of the MODE pin in the Pin Functions section.
Note 10: Guaranteed by correlation and design to wafer level
measurements for QFN packages.
Note 11: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
TYPICAL PERFORMANCE CHARACTERISTICS V_IN = 3.3V, RT/SYNC = SV_IN unless otherwise noted.
Efficiency vs Load Current
Burst Mode Operation (V_MODE = 0V)
100
V_OUT = 1.8V
90
80
70
60
50
40
30
20
V_IN = 2.5V
10
V_IN = 3.3V
0
V_IN = 5V
1
10
100
1000 10000
OUTPUT CURRENT (mA)
3616 G01
4
Efficiency vs Load Current
Burst Mode Operation (V_MODE = 0V)
100
V_OUT = 1.2V
90
80
70
60
50
40
30
20
V_IN = 2.5V
10
V_IN = 3.3V
0
V_IN = 5V
1
10
100
1000 10000
OUTPUT CURRENT (mA)
3616 G02
Efficiency vs Load Current
100
V_OUT = 1.8V, V_IN = 3.3V
90
80
70
60
50
40
30
20
Burst Mode OPERATION
10
PULSE-SKIPPING
FORCED CONTINUOUS
0
1
10
100
1000 10000
OUTPUT CURRENT (mA)
3616 G03
3616f