English
Language : 

LTC3129_15 Datasheet, PDF (4/30 Pages) Linear Technology – 15V, 200mA Synchronous Buck-Boost DC/DC Converter with 1.3A Quiescent Current
LTC3129
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). Unless otherwise noted, VIN = 12V, VOUT = 5V.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VOUT UV Hysteresis
VOUT Current – Shutdown
VOUT Current – Sleep
VOUT Current – Active
PGOOD Threshold, Falling
PGOOD Hysteresis
PGOOD Voltage Low
PGOOD Leakage
RUN = 0V, VOUT = 15V Including Switch Leakage
PWM = 0V, FB = 1.25V
PWM = VCC, VOUT = 15V (Note 4), FB = 1.25V
Referenced to Programmed VOUT Voltage
Referenced to Programmed VOUT Voltage
ISINK = 1mA
PGOOD = 15V
150
mV
10
100
nA
10
nA
5
9
µA
–5.5
–7.5
–10
%
2.5
%
250
300
mV
1
50
nA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3129 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3129E is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3129I is guaranteed over the full –40°C to 125°C operating junction
temperature range. The junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) according to the
formula: TJ = TA + (PD • θJA°C/W), where θJA is the package thermal
impedance. Note that the maximum ambient temperature consistent
with these specifications, is determined by specific operating conditions
in conjunction with board layout, the rated thermal package thermal
resistance and other environmental factors.
Note 3: Specification is guaranteed by design and not 100% tested in
production.
Note 4: Current measurements are made when the output is not switching.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may result in device degradation or failure.
Note 6: Failure to solder the exposed backside of the package to the PC
board ground plane will result in a much higher thermal resistance.
Note 7: Switch timing measurements are made in an open-loop test
configuration. Timing in the application may vary somewhat from these
values due to differences in the switch pin voltage during non-overlap
durations when switch pin voltage is influenced by the magnitude and
duration of the inductor current.
Note 8: Voltage transients on the switch pin(s) beyond the DC limits
specified in the Absolute Maximum Ratings are non-disruptive to normal
operation when using good layout practices as described elsewhere in the
data sheet and application notes and as seen on the product demo board.
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted.
Efficiency, VOUT = 2.5V
100
90
BURST
80
70
60
50
PWM
40
30
20
10
0
0.01
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
0.1
1
10 100 1000
OUTPUT CURRENT (mA)
3129 G01
Power Loss, VOUT = 2.5V
1000
100
PWM
10
1
0.1
0.01
0.01
BURST
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
0.1
1
10 100 1000
OUTPUT CURRENT (mA)
3129 G02
4
For more information www.linear.com/LTC3129
Efficiency, VOUT = 3.3V
100
90
BURST
80
70
60
50
PWM
40
30
20
10
0
0.01
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
0.1
1
10 100 1000
OUTPUT CURRENT (mA)
3129 G03
3129fb