LTC3129_15 Datasheet, PDF (27/30 Pages) Linear Technology – 15V, 200mA Synchronous Buck-Boost DC/DC Converter with 1.3A Quiescent Current

PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UD Package
(R¹e₁⁶f₆^-e^Lr_-e^e_Ln^a_ec^d_ae_d^PLT^l_P^aC_l^s_aD^tUi_sW^cDtiG^Q_cP^F#_Qa^N0_Fc5^(kN-^3a0^m_(g8₃-^em1_m7_m^×00³_×R^me₃^mv_mA⁾ )_m)
(Refere_En_xc_pe_osL_eT_dC_PD_aW_{d V}G_a#_ria0_t5_io-0_n8_A-_A1700 Rev A)
Exposed Pad Variation AA
LTC3129
0.70 ±0.05
3.50 ±0.05
1.65 ±0.05
2.10 ±0.05 ^{(4 SIDES)}
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ±0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ±0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
0.40 ±0.10
1
1.65 ±0.10
2
(4-SIDES)
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-4)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
(UD16 VAR A) QFN 1207 REV A
0.25 ±0.05
0.50 BSC
For more information www.linear.com/LTC3129
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