LTC3859AL Datasheet, PDF (35/44 Pages) Linear Technology – Triple Output, Buck/Buck/Boost Synchronous Controller with 28μA Burst Mode IQ

LTC3859AL
Applications Information
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the IC. These items are also illustrated graphically in the
layout diagram of Figure 11. Figure 12 illustrates the current
waveforms present in the various branches of the 2-phase
synchronous buck regulators operating in the continuous
mode. Check the following in your layout:
1. Are the top N-channel MOSFETs MTOP1 and MTOP2
located within 1cm of each other with a common drain
connection at C_IN? Do not attempt to split the input
decoupling for the two channels as it can cause a large
resonant loop.
2. Are the signal and power grounds kept separate? The
combined IC signal ground pin and the ground return
of C_INTVCC must return to the combined C_OUT (–) termi-
nals. The path formed by the top N-channel MOSFET,
Schottky diode and the C_IN capacitor should have short
leads and PC trace lengths. The output capacitor (–)
terminals should be connected as close as possible
to the (–) terminals of the input capacitor by placing
the capacitors next to each other and away from the
Schottky loop described above.
3. Do the LTC3859AL V_FB pins’ resistive dividers con-
nect to the (+) terminals of C_OUT? The resistive divider
must be connected between the (+) terminal of C_OUT
and signal ground. The feedback resistor connections
should not be along the high current input feeds from
the input capacitor(s).
4. Are the SENSE^– and SENSE⁺ leads routed together with
minimum PC trace spacing? The filter capacitor between
SENSE⁺ and SENSE^– should be as close as possible
to the IC. Ensure accurate current sensing with Kelvin
connections at the sense resistor.
5. Is the INTV_CC decoupling capacitor connected close
to the IC, between the INTV_CC and the power ground
pins? This capacitor carries the MOSFET drivers’ cur-
rent peaks. An additional 1µF ceramic capacitor placed
immediately next to the INTV_CC and PGND pins can help
improve noise performance substantially.
6. Keep the switching nodes (SW1, SW2, SW3), top gate
nodes (TG1, TG2, TG3), and boost nodes (BOOST1,
BOOST2, BOOST3) away from sensitive small-signal
nodes, especially from the opposites channel’s voltage
and current sensing feedback pins. All of these nodes
have very large and fast moving signals and therefore
should be kept on the output side of the LTC3859AL
and occupy minimum PC trace area.
7. Use a modified star ground technique: a low impedance,
large copper area central grounding point on the same
side of the PC board as the input and output capacitors
with tie-ins for the bottom of the INTV_CC decoupling
capacitor, the bottom of the voltage feedback resistive
divider and the SGND pin of the IC.
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