LTC3892_15 Datasheet, PDF (34/36 Pages) Linear Technology – 60V Low IQ, Dual, 2-Phase Synchronous Step-Down DC/DC Controller

LTC3892/LTC3892-1
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev J)
Exposed Pad Variation EA
7.56
(.298)
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
3.05
(.120)
0.45 ±0.05
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
9.60 – 9.80*
(.378 – .386)
7.56
(.298)
28 2726 25 24 23 22 21 20 19 18 1716 15
3.05
(.120)
6.40
(.252)
BSC
1 2 3 4 5 6 7 8 9 10 11 12 13 14
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN _MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
0.05 – 0.15
(.002 – .006)
FE28 (EA) TSSOP REV J 1012
34
For more information www.linear.com/LTC3892
38921f