LTC3736_15 Datasheet, PDF (27/28 Pages) Linear Technology – Dual 2-Phase, No RSENSE, Synchronous Controller with Output Tracking

LTC3736
PACKAGE DESCRIPTIO
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
4.50 ± 0.05 2.45 ± 0.05
(4 SIDES)
3.10 ± 0.05
0.70 ±0.05
4.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 5)
0.75 ± 0.05
2.45 ± 0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
0.23 TYP
(4 SIDES)
23 24
0.38 ± 0.10
1
2
PACKAGE
OUTLINE
(UF24) QFN 0603
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
.254 MIN
GN Package
24-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.045 ±.005
.337 – .344*
(8.560 – 8.738)
24 23 22 21 20 19 18 17 16 15 1413
.033
(0.838)
REF
.150 – .165
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.0165 ± .0015
.0250 TYP
RECOMMENDED SOLDER PAD LAYOUT
.015 ± .004
(0.38 ± 0.10)
× 45°
.007 – .0098
(0.178 – 0.249)
0° – 8° TYP
1 2 3 4 5 6 7 8 9 10 11 12
.053 – .068
(1.351 – 1.727)
.004 – .0098
(0.102 – 0.249)
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.008 – .012
(0.203 – 0.305)
.0250
(0.635)
BSC
GN24 (SSOP) 0502
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3736fa
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