LTC3567 Datasheet, PDF (27/28 Pages) Linear Technology – High Effi ciency USB Power Manager Plus 1A Buck-Boost Converter with I2C Control

TYPICAL APPLICATIONS
Direct Pin Controlled LTC3567 USB Power Manager with 3.3V/1A Buck-Boost
LTC3567
USB
4.5V TO 5.5V
C1
100k
10μF
100k T
2k
V_BUS
NTC
LTC3567
SW
V_OUT
GATE
PROG
CLPROG
0.1μF 3.01k
BAT
GND
CHRG
V_IN1
SWAB1
PUSH BUTTON
MICROCONTROLLER
LDO3V3
1μF
D_VCC
SWCD1
V_OUT1
PARTS LIST
C1: MURATA GRM21BR61A/06KE19
C2,C3: TAIYO-YUDEN JMK212BJ226MG
L1: COILCRAFT LPS4018-332MLC
L2: COILCRAFT LPS4018-222MLC
CHRGEN
EN1 GND
FB1
V_C1
I²C
2
L1
3.3μH
C2
22μF
OPTIONAL _1k
+
Li-Ion
TO
OTHER
LOADS
L2
2.2μH
2.2μF
33pF
121k
324k
330pF
15k
3.3V/1A
C3
DISK DRIVE
22μF
10pF
105k
3567 TA02
PACKAGE DESCRIPTION
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697 Rev B)
4.50 ± 0.05
2.45 ± 0.05
3.10 ± 0.05 (4 SIDES)
0.70 ±0.05
4.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ± 0.05
2.45 ± 0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
23 24
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
0.40 ± 0.10
1
2
PACKAGE
OUTLINE
(UF24) QFN 0105
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3567f
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