LTC3566-2_15 Datasheet, PDF (27/28 Pages) Linear Technology – High Efficiency USB Power Manager Plus 1A Buck-Boost Converter

LTC3566/LTC3566-2
TYPICAL APPLICATIONS
Direct Pin Controlled LTC3566/LTC3566-2 USB Power Manager with 3.3V/1A Buck-Boost
USB
4.5V TO 5.5V
C1
10μF
100k
100k T
2k
V_BUS
SW
0.1μF
3.01k
V_OUT
NTC ^LTC3566/
LTC3566-2
PROG
CLPROG
GATE
BAT
GND
CHRG
V_IN1
SWAB1
PARTS LIST
C1: MURATA GRM21BR61A/06KE19
C2,C3: TAIYO-YUDEN JMK212BJ226MG
L1: COILCRAFT LPS4018-332MLC
L2: COILCRAFT LPS4018-222MLC
LDO3V3
1μF
SWCD1
V_OUT1
TO DIGITAL
CONTROLLER
CHRGEN
MODE
EN1 GND
FB1
V_C1
ILIM
L1
3.3μH
OPTIONAL
+
Li-Ion
C2
22μF
1k
L2
2.2μH
2.2μF
33pF
121k
C3
22μF
324k
330pF
15k
10pF
105k
TO
OTHER
LOADS
3.3V/1A
DISK DRIVE
2
3566 TA02
PACKAGE DESCRIPTION
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697 Rev B)
4.50 p 0.05
2.45 p 0.05
3.10 p 0.05 (4 SIDES)
0.70 p0.05
4.00 p 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 p 0.05
2.45 p 0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
23 24
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 s 45o CHAMFER
0.40 p 0.10
1
2
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PACKAGE
OUTLINE
0.25 p0.05
0.50 BSC
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.200 REF
0.00 – 0.05
(UF24) QFN 0105
0.25 p 0.05
0.50 BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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