LTC3411 Datasheet, PDF (19/20 Pages) Linear Technology – 1.25A, 4MHz, Synchronous Step-Down DC/DC Converter

LTC3411
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ±0.05
R = 0.115
TYP
6
0.38 ± 0.10
10
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 5)
0.200 REF
0.75 ±0.05
0.00 – 0.05
(DD10) DFN 0403
5
1
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MS10 Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889 ± 0.127
(.035 ± .005)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.88 ± 0.10
(.192 ± .004)
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
GAUGE PLANE
0.53 ± 0.01
(.021 ± .006)
DETAIL “A”
0.18
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
SEATING
PLANE
1.10
(.043)
MAX
12345
0.17 – 0.27
(.007 – .011)
0.50
(.0197)
TYP
0.497 ± 0.076
(.0196 ± .003)
REF
3.00 ± 0.102
(.118 ± .004)
NOTE 4
0.86
(.034)
REF
0.13 ± 0.05
(.005 ± .002)
MSOP (MS) 0402
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
sn3411 3411fs
19