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LT1078_1 Datasheet, PDF (19/20 Pages) Linear Technology – Micropower, Dual and Quad, Single Supply, Precision Op Amps
LT1078/LT1079
PACKAGE DESCRIPTIO
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
CORNER LEADS OPTION
(4 PLCS)
0.300 BSC
(0.762 BSC)
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
0.045 – 0.065
(1.143 – 1.651)
0.014 – 0.026
(0.360 – 0.660)
0.200
(5.080)
MAX
0.005
(0.127)
MIN
0.015 – 0.060
(0.381 – 1.524)
0.025
(0.635)
RAD TYP
0.100
(2.54)
BSC
0.125
3.175
MIN
0.405
(10.287)
MAX
8
7
6
5
0.220 – 0.310
(5.588 – 7.874)
1
2
3
4
J8 1298
0.300 BSC
(0.762 BSC)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
0.045 – 0.065
(1.143 – 1.651)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
J Package
14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
0.200
(5.080)
MAX
0.005
(0.127)
MIN
0.785
(19.939)
MAX
14 13 12 11 10
9
8
0.015 – 0.060
(0.381 – 1.524)
0.025
(0.635)
RAD TYP
0.014 – 0.026
(0.360 – 0.660)
0.100
(2.54)
BSC
0.125
(3.175)
MIN
1
2
3
4
5
6
7
OBSOLETE PACKAGES
0.220 – 0.310
(5.588 – 7.874)
J14 1298
0.300 – 0.325
(7.620 – 8.255)
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
0.045 – 0.065
(1.143 – 1.651)
0.130 ± 0.005
(3.302 ± 0.127)
0.400*
(10.160)
MAX
8
7
6
5
0.009 – 0.015
(0.229 – 0.381)
0.065
(1.651)
TYP
+0.035
0.325 –0.015
( ) 8.255
+0.889
–0.381
0.100
(2.54)
BSC
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
0.125
(3.175)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
0.020
(0.508)
MIN
0.255 ± 0.015*
(6.477 ± 0.381)
12
34
N8 1098
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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