LT1078_1 Datasheet, PDF (18/20 Pages) Linear Technology – Micropower, Dual and Quad, Single Supply, Precision Op Amps

LT1078/LT1079
W
W
SI PLIFIED SCHEMATIC
1/2 LT1078, 1/4 LT1079
V⁺
10k 10k
2.2k
5.6k
1.3k
3.6k
Q5
Q6
Q16
Q14
Q15
Q32
IN^{– 600Ω}
IN^{+ 600Ω}
Q3
Q29
Q4 ^Q24
Q12
4
Q11
1
8.6k _C1
50pF
Q37
Q30
13
Q25
3k
Q26
C4
4pF
2.9k
Q1
Q21
Q2
Q22
C5
Q27
2.5pF
Q28
V⁺
C3
Q31
Q18 ^40pF
Q19
Q39
Q9
Q10 Q17
C2 Q7
Q8
175pF
Q23
Q20
Q34
6.2k
6.2k
1.35k
5k
Q54
11
Q35
30Ω
OUT
11.5k
Q53
2
Q47
Q46
V^–
12.5k
Q52
Q40
V⁺
Q41
Q44
150k
Q36
Q33
Q48
Q50 ^Q42
J1
Q49
10k
30Ω
V⁺
Q38
9.1k
Q45 Q51
700k
Q55
Q43
5.35k
700k
V^–
LT1078/79 • SIMPLIFIED SCHEM
PACKAGE DESCRIPTIO
0.040
(1.016)
MAX
SEATING
PLANE
0.010 – 0.045*
(0.254 – 1.143)
H Package
8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.305 – 0.335
(7.747 – 8.509)
45°TYP
0.028 – 0.034
(0.711 – 0.864)
0.027 – 0.045
(0.686 – 1.143)
PIN 1
0.050
(1.270)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
REFERENCE
PLANE
0.016 – 0.021**
(0.406 – 0.533)
0.230
(5.842)
TYP
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
OBSOLETE PACKAGE
H8 (TO-5) 0.230 PCD 1197
18
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