English
Language : 

LTC3209-1 Datasheet, PDF (18/20 Pages) Linear Technology – 600mA Main/Camera LED Controller
LTC3209-1/LTC3209-2
APPLICATIO S I FOR ATIO
Power Efficiency
To calculate the power efficiency (η) of a white LED driver
chip, the LED power should be compared to the input
power. The difference between these two numbers repre-
sents lost power whether it is in the charge pump or the
current sources. Stated mathematically, the power effi-
ciency is given by:
η = PLED
PIN
The efficiency of the LTC3209-1/LTC3209-2 depends upon
the mode in which it is operating. Recall that the
LTC3209-1/LTC3209-2 operates as a pass switch,
connecting VBAT to CPO, until dropout is detected at the
ILED pin. This feature provides the optimum efficiency
available for a given input voltage and LED forward
voltage. When it is operating as a switch, the efficiency is
approximated by:
( ) η = PLED = VLED • ILED = VLED
( ) PIN VBAT • IBAT VBAT
(1x Mode)
since the input current will be very close to the sum of the
LED currents.
At moderate to high output power, the quiescent current
of the LTC3209-1/LTC3209-2 is negligible and the expres-
sion above is valid.
Once dropout is detected at the LED pin, the LTC3209-1/
LTC3209-2 enables the charge pump in 1.5x mode.
In 1.5x boost mode, the efficiency is similar to that of a
linear regulator with an effective input voltage of 1.5 times
the actual input voltage. This is because the input current
for a 1.5x charge pump is approximately 1.5 times the load
current. In an ideal 1.5x charge pump, the power efficiency
would be given by:
( ( ) ) ( ) ηIDEAL
=
PLED
PIN
=
VLED • ILED
VBAT • (1.5) • ILED
=
VLED
1.5 • VBAT
(1.5x Mode)
Similarly, in 2x boost mode, the efficiency is similar to that
of a linear regulator with an effective input voltage of 2
times the actual input voltage. In an ideal 2x charge pump,
the power efficiency would be given by:
( ( ) ) ( ) ηIDEAL
=
PLED
PIN
=
VLED • ILED
VBAT • (2) • ILED
=
VLED
2 • VBAT
(2x Mode)
Thermal Management
For higher input voltages and maximum output current,
there can be substantial power dissipation in the
LTC3209-1/LTC3209-2. If the junction temperature in-
creases above approximately 150°C the thermal shut-
down circuitry will automatically deactivate the output
current sources and charge pump. To reduce maximum
junction temperature, a good thermal connection to the PC
board is recommended. Connecting the Exposed Pad to a
ground plane and maintaining a solid ground plane under
the device will reduce the thermal resistance of the pack-
age and PC board considerably.
18
320912fa