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LTC3548A Datasheet, PDF (15/20 Pages) Linear Technology – Dual Synchronous 400mA/800mA, 2.25MHz Step-Down DC/DC Regulator
LTC3548A
APPLICATIONS INFORMATION
Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3548A. These items are also illustrated graphically
in the layout diagram of Figure 2. Check the following in
your layout:
1. Does the capacitor CIN connect to the power VIN (Pin 3)
and GND (Exposed Pad) as closely as possible? This
capacitor provides the AC current to the internal power
MOSFETs and their drivers.
2. Are COUT and L1 closely connected? The (–) plate of
COUT returns current to GND and the (–) plate of CIN.
3. The resistor divider formed by R1 and R2 must be
connected between the (+) plate of COUT and a ground
sense line terminated near GND (Exposed Pad). The
feedback signals VFB1 and VFB2 should be routed away
from noisy components and traces, such as the SW lines
(Pins 4 and 7), and their traces should be minimized.
4. Keep sensitive components away from the SW pins.
The input capacitor, CIN, and the resistors R1 to R4
should be routed away from the SW traces and the
inductors.
5. A ground plane is preferred, but if not available keep
the signal and power grounds segregated with small-
signal components returning to the GND pin at one
point. Additionally the two grounds should not share
the high current paths of CIN or COUT.
6. Flood all unused areas on all layers with copper. Flooding
with copper will reduce the temperature rise of power
components. These copper areas should be connected
to VIN or GND.
VIN
VOUT2
C5
R4
COUT2
CIN
RUN/SS2 VIN RUN/SS1
L2
MODE/SYNC
POR
SW2
SW1
LTC3548A
VFB2
VFB1
GND
R3
L1
C4
R2
R1
VOUT1
COUT1
BOLD LINES INDICATE HIGH CURRENT PATHS
3548A F02
Figure 2. LTC3548A Layout Diagram (See Board Layout Checklist)
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