LTC3221_15 Datasheet, PDF (11/12 Pages) Linear Technology – Micropower, Regulated Charge Pump

PACKAGE DESCRIPTIO
LTC3221/
LTC3221-3.3/LTC3221-5
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
2.50 ±0.05
1.15
±0.05
0.61 ±0.05
(2 SIDES)
0.675 ±0.05
PACKAGE ^{PIN 1 BAR}
OUTLINE ^{TOP MARK}
(SEE NOTE 6)
0.25 ± 0.05
0.50 BSC
1.42 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
R = 0.115
TYP
0.56 ± 0.05
4
(2 SIDES)
0.38 ± 0.05
6
2.00 ±0.10
(4 SIDES)
0.75 ±0.05
0.00 – 0.05
PIN 1
CHAMFER OF
EXPOSED PAD
3
1
(DC6) DFN 1103
0.25 ± 0.05
0.50 BSC
1.37 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
3221f
11