LTC3407AIDD Datasheet, PDF (15/16 Pages) Linear Integrated Systems – Dual Synchronous, 600mA, 1.5MHz Step-Down DC/DC Regulator

LTC3407
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev B)
0.70 ±0.05
R = 0.125
TYP
6
0.40 ± 0.10
10
3.55 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
(DD) DFN REV B 0309
5
1
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev C)
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
0.497 ± 0.076
(.0196 ± .003)
REF
5.23
(.206)
MIN
2.083 ± 0.102 3.20 – 3.45
(.082 ± .004) (.126 – .136)
0.254
(.010)
GAUGE PLANE
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.007)
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
12345
1.10
(.043)
MAX
0.86
(.034)
REF
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
BSC
0.1016 ± 0.0508
(.004 ± .002)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.06 ± 0.102
1
(.081 ± .004)
1.83 ± 0.102
(.072 ± .004)
DETAIL “B”
10
0.29
REF
0.05 REF
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
MSOP (MSE) 0908 REV C
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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