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LTC3407AIDD Datasheet, PDF (12/16 Pages) Linear Integrated Systems – Dual Synchronous, 600mA, 1.5MHz Step-Down DC/DC Regulator
LTC3407
APPLICATIONS INFORMATION
the regulator operating in a 70°C ambient temperature is
approximately:
TJ = 2 • 0.153 • 45 + 70 = 84°C
which is below the absolute maximum junction tempera-
ture of 125°C.
Design Example
As a design example, consider using the LTC3407 in an
portable application with a Li-Ion battery. The battery pro-
vides a VIN = 2.8V to 4.2V. The load requires a maximum
of 600mA in active mode and 2mA in standby mode. The
output voltage is VOUT = 2.5V. Since the load still needs
power in standby, Burst Mode operation is selected for
good low load efficiency.
First, calculate the inductor value for about 30% ripple
current at maximum VIN:
L
≥
2.5V
1.5MHz • 300mA
•
⎛⎝⎜1–
2.5V
4.2V
⎞
⎠⎟
=
2.25μH
Choosing the closest inductor from a vendor of 2.2μH
inductor, results in a maximum ripple current of:
ΔIL
=
2.5V
1.5MHz • 2.2μH
•
⎛⎝⎜1−
2.5V
4.2V
⎞
⎠⎟
=
307mA
For cost reasons, a ceramic capacitor will be used. COUT
selection is then based on load step droop instead of ESR
requirements. For a 5% output droop:
COUT
≈
3
600mA
1.5MHz • (5% •
2.5V)
=
9.6μF
The closest standard value is 10μF. Since the output imped-
ance of a Li-Ion battery is very low, CIN is typically 10μF.
The output voltage can now be programmed by choosing
the values of R1 and R2. To maintain high efficiency, the
current in these resistors should be kept small. Choosing
2μA with the 0.6V feedback voltage makes R1~300k. A close
standard 1% resistor is 280k, and R2 is then 887k.
The POR pin is a common drain output and requires a pull-
up resistor. A 100k resistor is used for adequate speed.
Figure 1 shows the complete schematic for this design
example.
Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3407. These items are also illustrated graphically
in the layout diagram of Figure 3. Check the following in
your layout:
1. Does the capacitor CIN connect to the power VIN (Pin
3) and GND (exposed pad) as close as possible? This
capacitor provides the AC current to the internal power
MOSFETs and their drivers.
2. Are the COUT and L1 closely connected? The (–) plate of
COUT returns current to GND and the (–) plate of CIN.
3. The resistor divider, R1 and R2, must be connected
between the (+) plate of COUT and a ground sense line
terminated near GND (Exposed Pad). The feedback signals
VFB should be routed away from noisy components and
traces, such as the SW line (Pins 4 and 7), and its trace
should be minimized.
4. Keep sensitive components away from the SW pins. The
input capacitor CIN and the resistors R1 to R4 should be
routed away from the SW traces and the inductors.
5. A ground plane is preferred, but if not available, keep
the signal and power grounds segregated with small signal
components returning to the GND pin at one point and
should not share the high current path of CIN or COUT.
6. Flood all unused areas on all layers with copper. Flood-
ing with copper will reduce the temperature rise of power
components. These copper areas should be connected to
VIN or GND.
VIN
CIN
RUN2 VIN RUN1
MODE/SYNC
POR
VOUT2
LTC3407
L2
L1
SW2
SW1
C5
C4
VOUT1
R4
COUT2
VFB2
VFB1
GND
R2
R3
R1
COUT1
BOLD LINES INDICATE HIGH CURRENT PATHS
3407 F03
Figure 3. LTC3407 Layout Diagram (See Board Layout Checklist)
3407fa
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