LT1101_1 Datasheet, PDF (15/16 Pages) Linear Integrated Systems – Precision, Micropower, Single Supply Instrumentation Amplifier (Fixed Gain = 10 or 100)

PACKAGE DESCRIPTIO
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
.040
(1.016)
MAX
SEATING
PLANE
.010 – .045*
(0.254 – 1.143)
.335 – .370
(8.509 – 9.398)
DIA
.305 – .335
(7.747 – 8.509)
.050
(1.270)
MAX
GAUGE
PLANE
.165 – .185
(4.191 – 4.699)
REFERENCE
PLANE
.500 – .750
(12.700 – 19.050)
.016 – .021**
(0.406 – 0.533)
45°TYP
.028 – .034
(0.711 – 0.864)
.027 – .045
(0.686 – 1.143)
PIN 1
.200
(5.080)
TYP
.110 – .160
(2.794 – 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
.016 – .024
**FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS _{(0.406 – 0.610) H8(TO-5) 0.200 PCD 0801}
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
CORNER LEADS OPTION
(4 PLCS)
.045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
.300 BSC
(7.62 BSC)
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
.005
(0.127)
MIN
.025
(0.635)
RAD TYP
.405
(10.287)
MAX
8
7
65
.220 – .310
(5.588 – 7.874)
1
2
3
4
.200
(5.080)
MAX
.015 – .060
(0.381 – 1.524)
.008 – .018
(0.203 – 0.457)
0° – 15°
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
.045 – .065
(1.143 – 1.651)
.014 – .026
(0.360 – 0.660)
OBSOLETE PACKAGES
.100
(2.54)
BSC
.125
3.175
MIN
J8 0801
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LT1101
1101fa
15