HC010A0F1-S Datasheet, PDF (18/19 Pages) Lineage Power Corporation – 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Surface Mount Information (continued)
240
235
230
225
220
215
210
205
200
0
10
20
30
40
50
60
TIME LIMIT (S)
Figure 25. Time Limit Curve Above 205^oC Reflow .
Lead Free Soldering
The SMT modules of the HW/HC series are lead-free
(Pb-free) and RoHS compliant and are both forward
and backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 26.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
MSL Rating
The HW/HC series SMT modules have a MSL rating
of 1.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
300
Per J-STD-020 Rev. C
250
Peak Temp 245° C
Cooling Zone
200
4° C / second
150
Heating Zone
1° C / second
* Min. Time Above 235° C
15 seconds
* Time Above 217° C
60 seconds
100
50
0
Reflow Time (in seconds)
Figure 26. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module
will meet the solder ball requirements per
J-STD-001B. These requirements state that solder
balls must neither be loose nor violate the power
module minimum electrical spacing.
The cleanliness designator of the open frame power
module is C00 (per J specification).
LINEAGE POWER
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