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KSM830 Datasheet, PDF (2/4 Pages) Kersemi Electronic Co., Ltd. – Advanced high cell denity trench technology for ultra RDS(ON) | |||
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KSM830
KERSMI ELECTRONIC CO.,LTD.
Symbol
Parameter
RÆJC
Thermal Resistance,Junction to Case1
RÆJA
Thermal Resistance,Junction to Ambient1
Ratings
62
1.7
Units
â/W
Package Marking and Ordering Information
Part NO.
KSM830
Marking
KSM830
Package
TO-220
Electrical Characteristics TC=25â unless otherwise noted
Symbol
BVDSS
IDSS
IGSS
VGS(th)
RDS(ON)
GFS
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
VSD
trr
Qrr
Parameter
Conditions
Min Typ
Off Characteristics
Drain-Sourtce Breakdown Voltage
VDS=0V,ID=250μA
500 â
Zero Gate Voltage Drain Current
VDS=0V, VDS=32V
ââ
Gate-Source Leakage Current
VDS=±20V, VDS=0A
ââ
On Characteristics
GATE-Source Threshold Voltage
VDS=VDS, ID=250μA
2.0 â
Drain-Source On Resistance²
VDS=10V,ID=6A
VDS=2.5V,ID=5A
ââ
ââ
Forward Transconductance
VDS=5V,ID=12A
2.5 â
Dynamic Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
VDS=15V,VGS=0V,
f=1MHz
â 610
â 160
â 68
Switching Characteristics
Turn-On Delay Time
VDS=20V,
â 8.2
Rise Time
â 16
Turn-Off Delay Time
VGS=10V,RGEN=3.3Ω
â 42
Fall Time
â 16
Total Gate Charge
ââ
Gate-SourceCharge
VGS=4.5V, VDS=20V,
ââ
Gate-Drain âMillerâ Charge
ID=6A
ââ
Drain-Source Diode Characteristics
Source-Drain Diode ForwardVoltage²
VGS=0V,IS =1A
ââ
Reverse Recovery Time
Reverse Recovery Charge
IF=7A,di/dt=100A/μS
â 320
â 1.0
Max
â
25
±100
4.0
1.5
â
â
â
â
â
â
â
â
â
38
5.0
22
1.6
640
2.0
Units
v
μA
nA
V
Ω
S
pF
ns
ns
ns
ns
nC
nC
nC
V
ns
nC
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