F862BC104M310Z Datasheet, PDF (8/14 Pages) Kemet Corporation – F862 Series Metallized Polypropylene Film for Harsh Environmental Conditions, Class X2, 310 VAC (Automotive Grade)

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F862 Series Metallized Polypropylene Film for Harsh Environmental Conditions, Class X2, 310 VAC (Automotive Grade)
Soldering Process
The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder.
This has increased the liquidus temperature from that of 183ºC for SnPb eutectic alloy to 217 – 221ºC for the new alloys. As a
result, the heat stress to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave
temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is 160 – 170ºC). Wave
soldering can be destructive, especially for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm),
and great care has to be taken during soldering. The recommended solder profiles from KEMET should be used. Please consult
KEMET with any questions. In general, the wave soldering curve from IEC Publication 61760-1 Edition 2 serves as a solid guideline
for successful soldering. Please see Figure 1.
Reflow soldering is not recommended for through-hole film capacitors. Exposing capacitors to a soldering profile in excess of the
above the recommended limits may result to degradation or permanent damage to the capacitors.
Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert
through-hole parts after the curing of surface mount parts. Consult KEMET to discuss the actual temperature profile in the oven,
if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended.
Please allow time for the capacitor surface temperature to return to a normal temperature before the second soldering cycle.
Manual Soldering Recommendations
Following is the recommendation for manual
soldering with a soldering iron.
Recommended Soldering Temperature
400
350
300
250
200
150
100
50
0
0
1
2
3
4
5
6
7
8
Soldering time (sec)
Wave Soldering Recommendations
300
250
260°C
First wave
200
ΔT <150°C
Preheating
150
2+3s max
Second wave
100
Tp reh eat
115°C max
100°C
Typical
50
Cooling
ca 2°C/s
ca 3.5°C/s typical
ca 5°C/s
0
0
40
80
120
160
200
240
Time (s)
The soldering iron tip temperature should
be set at 350°C (+10°C maximum) with the
soldering duration not to exceed more than 3
seconds.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
F3092_F862_X2_310 • 9/23/2016 8