JHB7036A Datasheet, PDF (34/36 Pages) Jewel Hill Electronic – SPECIFICATIONS FOR LCD MODULE

JEWEL HILL ELECTRONIC CO.,LTD.
No
Item
Criterion
AQL
Symbols:
x: Chip length y: Chip width
z: Chip thickness
k: Seal
width
t: Glass thickness a: LCD side length
l: Electrode pad length
1 General glass chip
1.1 Chip on panel surface and crack between panels:
z: Chip thickness
y: Chip width
X: Chip length
Chipped
09
z<=1/2t
not over viewing area
X<=1/8a
2.5
glass
1/2t<z<=2t
Not exceed 1/3k
X<=1/8a
If there are 2 or more chips, x is the total length of each chip
1.2 Comer crack:
z: Chip thickness
y: Chip width
X: Chip length
z<=1/2t
not over viewing area
X<=1/8a
1/2t<z<=2t
Not exceed 1/3k
X<=1/8a
If there are 2 or more chips, x is the total length of each chip
1. COB seal may not have pinholes larger than 0.2mm or Contamination.
2.COB seal surface may not have pinholes through to the IC.
3.The height of the COB should not exceed the height indicated in the assembly diagram.
2.5
2.5
0.65
4. There may not be more than 2mm of sealant outside the seal area on the
2.5
PCB,
10
PCB. And there should be no more than three places.
COB
5. No oxidation or contamination PCB terminals.
2.5
6. Parts on the PCB must be he same as on the production
0.65
7. The jumper on the PCB should conform to the product characteristic char. ^0.65
8. If solder gets on bezel tab pads, LED pad, zebra pad or screw hole pad,
2.5
make sure it is smoothed down.
JHB7036A VER: 01.01
- 33 -
Issue date: 2013-08-01