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GWM160-0055X1 Datasheet, PDF (1/6 Pages) IXYS Corporation – Three phase full Bridge with Trench MOSFETs in DCB isolated high current package
Three phase full Bridge
with Trench MOSFETs
in DCB isolated high current package
GWM 160-0055X1
VDSS = 55 V
ID25
= 150 A
R = DSon typ. 2.7 mW
L+
G3
G5
G1
S3
S5
S1
L1
L2
L3
G4
G6
G2
S4
S6
S2
L-
MOSFETs
Symbol Conditions
VDSS
VGS
TJ = 25°C to 150°C
ID25
TC = 25°C
ID90
TC = 90°C
IF25
TC = 25°C (diode)
IF90
TC = 90°C (diode)
Maximum Ratings
55 V
± 20
V
150 A
115 A
120 A
75 A
Symbol Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
R 1)
DSon
VGS(th)
IDSS
IGSS
on chip level at
VGS = 10 V; ID = 100 A
VDS = 20 V; ID = 1 mA
VDS = VDSS; VGS = 0 V
VGS = ± 20 V; VDS = 0 V
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = 125°C
Qg
Qgs
VGS = 10 V; VDS = 12 V; ID = 160 A
Qgd
td(on)
tr
td(off)
tf
Eon
Eoff
Erecoff
inductive load
VGS = 10 V; VDS = 24 V
ID = 100 A; RG = 39 Ω;
TJ = 125°C
RthJC
RthJH
with heat transfer paste (IXYS test setup)
1) VDS = ID·(RDS(on) + 2RPin to ) Chip
2.7
4.5
2.5
0.1
105
tbd
tbd
140
125
550
120
0.17
0.60
0.004
1.3
3.3 mW
mW
4.5 V
1 µA
mA
0.2 µA
nC
nC
nC
ns
ns
ns
ns
mJ
mJ
mJ
1.0 K/W
1.6 K/W
Straight leads
Surface Mount Device
Applications
AC drives
• in automobiles
- electric power steering
- starter generator
• in industrial vehicles
- propulsion drives
- fork lift drives
• in battery supplied equipment
Features
• MOSFETs in trench technology:
- low RDSon
- optimized intrinsic reverse diode
• package:
- high level of integration
- high current capability 300 A max.
- aux. terminals for MOSFET control
- terminals for soldering or welding
connections
- isolated DCB ceramic base plate
with optimized heat transfer
• Space and weight savings
Package options
• 2 lead forms available
- straight leads (SL)
- SMD lead version (SMD)
IXYS reserves the right to change limits, test conditions and dimensions.
© 2011 IXYS All rights reserved
20110307i
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