IS49NLC96400A Datasheet, PDF (1/36 Pages) Integrated Silicon Solution, Inc – Reduced cycle time

IS49NLC96400A, IS49NLC18320A, IS49NLC36160A
576Mb (64Mbx9, 32Mbx18, 18Mbx36)
Common I/O RLDRAM^ 2 Memory
ADVANCED INFORMATION
SEPTEMBER 2014
FEATURES
 533MHz DDR operation (1.067 Gb/s/pin data rate)
 38.4Gb/s peak bandwidth (x36 at 533 MHz clock
frequency)
 Reduced cycle time (15ns at 533MHz)
 32ms refresh (16K refresh for each bank; 128K
refresh command must be issued in total each 32ms)
 8 internal banks
 Non-multiplexed addresses (address multiplexing
option available)
 SRAM-type interface
 Programmable READ latency (RL), row cycle time,
and burst sequence length
 Balanced READ and WRITE latencies in order to
optimize data bus utilization
 Data mask signals (DM) to mask signal of WRITE
data; DM is sampled on both edges of DK.
OPTIONS
 Package:
 144-ball FBGA (leaded)
 144-ball FBGA (lead-free)
 Configuration:
 64Mx9
 32Mx18
 16Mx36
 Clock Cycle Timing:
Speed Grade
-18
t_RC
15
t_CK
1.875
-25E
15
2.5
 Differential input clocks (CK, CK#)
 Differential input data clocks (DKx, DKx#)
 On-die DLL generates CK edge-aligned data and
output data clock signals
 Data valid signal (QVLD)
 HSTL I/O (1.5V or 1.8V nominal)
 25-60Ω matched impedance outputs
 2.5V V_EXT, 1.8V V_DD, 1.5V or 1.8V V_DDQ I/O
 On-die termination (ODT) R_TT
 IEEE 1149.1 compliant JTAG boundary scan
 Operating temperature:
Commercial
(T_C = 0° to +95°C )
Industrial
(T_C = -40°C to +95°C; T_A = -40°C to +85°C)
-25
-33
Unit
20
20
ns
2.5
3.3
ns
Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at
any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein.
Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for
products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the
product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not
authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
RLDRAM^ is a registered trademark of Micron Technology, Inc.
Integrated Silicon Solution, Inc. – www.issi.com –
Rev. 00A, 9/10/2014
1