IS43TR16256A-15HBL Datasheet, PDF (1/88 Pages) Integrated Silicon Solution, Inc – 512Mx8, 256Mx16 4Gb DDR3 SDRAM

IS43/46TR16256A, IS43/46TR16256AL,
IS43/46TR85120A, IS43/46TR85120AL
512Mx8, 256Mx16 4Gb DDR3 SDRAM
FEATURES
 Standard Voltage: V_DD and V_DDQ = 1.5V ± 0.075V
 Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V
- Backward compatible to 1.5V
 High speed data transfer rates with system
frequency up to 1066 MHz
 8 internal banks for concurrent operation
 8n-Bit pre-fetch architecture
 Programmable CAS Latency
 Programmable Additive Latency: 0, CL-1,CL-2
 Programmable CAS WRITE latency (CWL) based
on tCK
 Programmable Burst Length: 4 and 8
 Programmable Burst Sequence: Sequential or
Interleave
 BL switch on the fly
 Auto Self Refresh(ASR)
 Self Refresh Temperature(SRT)
SEPTEMBER 2016
 Refresh Interval:
7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C
3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C
 Partial Array Self Refresh
 Asynchronous RESET pin
 TDQS (Termination Data Strobe) supported (x8
only)
 OCD (Off-Chip Driver Impedance Adjustment)
 Dynamic ODT (On-Die Termination)
 Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)
 Write Leveling
 Up to 200 MHz in DLL off mode
 Operating temperature:
Commercial (T_C = 0°C to +95°C)
Industrial (T_C = -40°C to +95°C)
Automotive, A1 (T_C = -40°C to +95°C)
Automotive, A2 (T_C = -40°C to +105°C)
OPTIONS
 Configuration:
512Mx8
256Mx16
 Package:
96-ball BGA (9mm x 13mm) for x16
78-ball BGA (9mm x 10.5mm) for x8
ADDRESS TABLE
Parameter
Row Addressing
Column Addressing
Bank Addressing
Page size
Auto Precharge
Addressing
BL switch on the fly
512Mx8
A0-A15
A0-A9
BA0-2
1KB
A10/AP
A12/BC#
256Mx16
A0-A14
A0-A9
BA0-2
2KB
A10/AP
A12/BC#
SPEED BIN
Speed Option
15H
125K
107M
JEDEC Speed Grade DDR3-1333H DDR3-1600K DDR3-1866M
CL-nRCD-nRP
9-9-9
11-11-11
13-13-13
tRCD,tRP(min)
13.5
13.75
13.91
Note:Faster speed options are backward compatible to slower speed options.
093N
DDR3-2133N
14-14-14
13.09
Units
tCK
ns
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised
to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product
can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use
in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. – www.issi.com –
1
Rev. G2
07/28/2016