SM-BGA-9052 Datasheet, PDF (3/4 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

9.48
23.00
Y
X
TOP VIEW
23.00
23.00
0.96±0.10
0.39±0.03
1.2800±0.1200
0.57±0.10
Ironwood package code: BGA911A
21.45
0.40±0.05 (x911)
0.15 M Z X Y
0.08 M
A1 location
0.65 typ.
9.49
23.00
0.32±0.05
SIDE VIEW
1.51±0.12
0.38±0.05
1.83±0.13
0.5700
19.00
17 min
0.40±0.05 (x911)
0.15 M Z X Y
0.08 M
21.45
21.45
34x34 array
BOTTOM VIEW
A1 location
0.65 typ.
0.32±0.05
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9052 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 150.03
STATUS: Released
ENG: S. Huang
FILE: SM-BGA-9052 Dwg
21.45
34x34 array
SHEET: 3 OF 4
DRAWN BY: M. Raske
DATE: 8/28/2014
REV. A
SCALE: 3:1