SM-BGA-9052 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

SM-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND
TEST APPLICATIONS
32.600
Features
A1 corner
47.225
• Wide temperature range (-55C to +150C).
• Current capability is 4A per pin at 14C temperature rise.
• Over 40GHz bandwidth @-1dB for edge pins
• Low and stable contact resistance for reliable production yield.
• Self inductance under 0.21nH.
• Clam shell socket lid
38.621
Recommended torque is 30 in-lbs
on heat sink compression screw
30
SM interposer
15.000
58.532
66.456
10.100
2.450 _14.100
7.9375
2
30.725
Description: SM-BGA socket for 23x23mm 34x34 array 0.65mm pitch BGA911 with heat sink
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9052 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 150.03
STATUS: Released
ENG: S. Huang
FILE: SM-BGA-9052 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 8/28/2014
14.3770
REV. A
SCALE: 1:1