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SM-BGA-9006 Datasheet, PDF (3/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer
Compatible BGA Spec
TOP VIEW
X
D
Y
E
0.20
e
3 Øb
Ø0.15 Z X Y
Ø0.08
BOTTOM VIEW
SIDE VIEW
DETAIL
A
A1
DETAIL
Z
4
5
0.20 Z
0.12 Z
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME
Y14.5M-1994.
Dimension b is measured at the maximum
3 solder ball diameter, parallel to datum plane Z.
Datum Z (seating plane) is defined by the
4 spherical crowns of the solder balls.
Parallelism measurement shall exclude any
5 effect of mark on top surface of package.
DIM
MIN
MAX
A
1.70
A1
0.25
0.35
b
0.38
0.48
D
15.85
16.15
E
15.85
16.15
e
0.8 BSC
Array: 19x19
SM-BGA-9006 Drawing
© 2011 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Status: Released
Scale: NA
Rev: A
Drawing: E. Smolentseva
Date: 10/10/11
File: SM-BGA-9006 Dwg.mcd
Modified:
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