SM-BGA-9006 Datasheet, PDF (2/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Recommended PCB Layout
Top View
1.25mm±0.13mm (x4)
Orientation Mark
1.25mm±0.13mm (x4)
2.16mm(x4)
21.225mm±0.125mm(x4)
Socket size
14.40mm
Note: BGA pattern is not symmetrical
with respect to the mounting holes.
2.54mm
14.40mm
0.80mm typ.
2.54mm
Ø 0.85mm±0.03mm (x2)
non plated Alignment Hole
Ø 0.360mmxPAD
5.08mm
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
SM-BGA-9006 Drawing
© 2011 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
18.725mm (x4)
Ø 1.61mm±0.05mm (x4)
non plated Mounting Hole
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
BGA IC Size Pitch Array
Status: Released
Scale: NA
Rev: A
16x16mm 0.8mm 19x19
Drawing: E. Smolentseva
Date: 10/10/11
PAGE 2 of 3
File: SM-BGA-9006 Dwg.mcd
Modified: