SM-BGA-9006 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
21.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
6
21.225mm
4
3
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
Recommended Torque = 3 in lb
8
2
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
5
Elastomer: Embedded Silver Ball Matrix
Thickness = 0.5969mm - 0.6604mm
6 Ball Guide: Kapton polyimide.
7
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
8
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
9 Nylon washer: 1.73mm ID; 4.78mm OD, 0.64mm thick
7
5
9
Customer's
BGA IC
Customer's Target PCB
SM-BGA-9006 Drawing
© 2011 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: NA
Rev: A
Drawing: E. Smolentseva
Date: 10/10/11
File: SM-BGA-9006 Dwg.mcd
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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