IRF9395MPBF Datasheet, PDF (3/9 Pages) International Rectifier – Isolation Switch for Input Power or Battery Application

Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
T_P
T_J
T_STG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
R_θJA
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Parameter
e Junction-to-Ambient
i Junction-to-Ambient
j Junction-to-Ambient
f k Junction-to-Case ,
Junction-to-PCB Mounted
e Linear Derating Factor
IRF9395MTRPbF
Max.
2.1
1.3
57
270
-40 to + 150
Typ.
Max.
–––
60
12.5
–––
20
–––
–––
2.2
1.0
–––
0.02
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
0.001
0.0001
1E-006
R _{1R 1}
R _{2R 2}
R _{3R 3}
R _{4R 4}
Ri (°C/W) τi (sec)
τ_{J τJ}
τ_{1 τ1}
τ_AτA 10.609
0.239813
τ_{2 τ2}
τ_{3 τ3}
τ_{4 τ4}
3.5414 0.007823
24.659 2.632793
Ci= τi/Ri
SINGLE PULSE
Ci= τi/Ri
21.032 18.15739
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1E-005 0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
10
100
1000
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
Notes:
‡ Used double sided cooling, mounting pad with large heatsink.
ˆ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
‰ R_θ is measured at T_J of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
‰ Mounted on minimum footprint full size
‰ Mounted to a PCB with small _{board with metalized back and with small}
clip heatsink (still air)
clip heatsink (still air)
3